Reduced Order Models of Heat Transfer in Packaged Electronic Systems for Efficient Thermal Design
Students: Pramod Mathai
Analysis of heat transfer in packaged electronics
(palm pilots, cell phones, laptops) is computationally expensive. We used model reduction
tools to create a library of cheap component models that can be connected into systems
and simulated cheaply. This allows optimal thermal design of complex systems.
Full order model (~20000 states)
Reduced order model (~2000 states)
Full vs reduced order model of temperature on the board. The model is achieved by interconnecting chip models together, any board layout can be simulated in seconds.
