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Benjamin Shapiro
Fischell Department of Bioengineering
Joint appointment with:
Institute for Systems Research
2246 Kim Building
University of Maryland
College Park, MD 20742
Tel: (301) 405-4191
Fax: (301) 405-9953

Reduced Order Models of Heat Transfer in Packaged Electronic Systems for Efficient Thermal Design
Students: Pramod Mathai

packaged electronicsAnalysis of heat transfer in packaged electronics (palm pilots, cell phones, laptops) is computationally expensive. We used model reduction tools to create a library of cheap component models that can be connected into systems and simulated cheaply. This allows optimal thermal design of complex systems.

full order model
Full order model (~20000 states)

reduced model
Reduced order model (~2000 states)

Full vs reduced order model of temperature on the board. The model is achieved by interconnecting chip models together, any board layout can be simulated in seconds.








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